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  • Doube Side Polish Sapphire Wafer 2inch 4inch 6inch Sapphire Wafers
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  • Doube Side Polish Sapphire Wafer 2inch 4inch 6inch Sapphire Wafers

Doube Side Polish Sapphire Wafer 2inch 4inch 6inch Sapphire Wafers

Doube Side Polish Sapphire Wafer 2inch 4inch 6inch Sapphire Wafers is a material of a unique combination of physical, chemical and optical properties, which make it resistant to high temperature, thermal shock, water and sand erosion, and scratching
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Doube Side Polish Sapphire Wafer 2inch 4inch 6inch Sapphire Wafers
Sapphire
is a material of a unique combination of physical, chemical and optical properties, which make it resistant to high temperature, thermal shock, water and sand erosion, and scratching. It is a superior window material for many IR applications from 3µm to 5µm. C-plane sapphire substrates are widely used to grow III-V and II-VI compounds such as GaN for blue LED and laser diodes, while R-plane sapphire substrates are used for the hetero-epitaxial deposition of silicon for microelectronic IC applications.


Features: 
All orientations are available, custom orientation is welcome;    
Wafer size from 2 to 6 inches are available for all types;
Thin wafer down to 250um for 2 inch, 300um for 4 inch and 300um for 6 inch;

 

Specification: 

Orientation R-plane, C-plane, A-plane, M-plane or a specified orientation
Orientation Tolerance ± 0.3°
Diameter 2 inches, 3 inches, 4 inches, 6 inches, 8 inches or others
Diameter Tolerance 0.1mm for 2 inches, 0.2mm for 3 inches, 0.3mm for 4 inches, 0.5mm for 6 inches
Thickness 0.25mm, 0.33mm, 0.43mm, 0.65mm, 1mm or others;
Thickness Tolerance 25μm
Primary Flat Length 16.0±1.0mm for 2 inches, 22.0±1.0mm for 3 inches, 30.0±1.5mm for 4 inches, 47.5/50.0±2.0mm for 6 inches
Primary Flat Orientation A-plane (1 1-2 0 ) ± 0.2°;  C-plane (0 0-0 1 ) ± 0.2°,  Projected C-Axis 45 +/- 2°
TTV ≤10µm for 2 inches,  ≤15µm for 3 inches,  ≤20µm for 4 inches,  ≤25µm for 6 inches
BOW ≤10µm for 2 inches,  ≤15µm for 3 inches,  ≤20µm for 4 inches,  ≤25µm for 6 inches
Front Surface Epi-Polished (Ra< 0.3nm for C-plane, 0.5nm for other orientations)
Back Surface Fine ground (Ra=0.6μm~1.4μm) or Epi-polished
Packaging Packaged in class 100 cleanroom environment


Applications: 
Growth substrate for III-V and II-VI compounds   
Electronics and optoelectronics
IR applications
Silicon On Sapphire Integrated Circuit(SOS)
Radio Frequency Integrated Circuit(RFIC)

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